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Heat can cause equipmentto shut down due to malfunction and shorten the life and functionality of high-performance electronic components before that happens
1、Heat can cause equipmentto shut down due to malfunction and shorten the life and functionality of high-performance electronic components before that happens
2、High heat dissipation and compact space are the key to theproblem.Therefore, heat dissipation is the key to increasing the service life of products and improving operational safety and reliablity
3、A temperature-controlled fan tray is also available
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10. 01, 2023
For PCB board of the subrack insertion and extraction, Provides assistance when pulled out.Composed of four parts: handle, scutcheon, printed board bracket, and shaft. Handle material: PC+GF20%, Fire retardant standard: UL94V1, printed board bracket material: die-cast zinc alloy surface nickel plating.
10. 08, 2023
The subrack does not have a series of profiles, and after receiving an order, it is usually customized and processed according to the drawings. Products from different customers and products of different specifications from the same customer all need to be redesigned and processed, resulting in higher costs;
